Apple's 3D Sensing is Two Years Ahead of Qualcomm's

Joanna Estrada
August 23, 2017

The latest leak in the smartphone world shows the picture of Apple's 3D face scanning module that will be equipped on iPhone 8. Adding to the soaring excitement, a new report from KGI analysts Ming-Chi Kuo says that the Cupertino-based tech company has made some significant advancements in 3D sensing technology that rivals like Qualcomm can not match until at least 2019. He also goes onto say that Qualcomm is not going to be making a large number of shipments until at least 2019 and he backs up his claims with a fair amount of reasoning as well. While Qualcomm has excelled in designing advanced application processors and baseband solutions, it lags behind in other crucial aspects of smartphone applications like dual-camera (many Android phones have instead adopted solutions used to simulate optical zoom from third-party vendors such as Arcsoft (US)) and ultrasonic fingerprint scanner (while a new reference design has been released, there is no visibility on mass production). The level of immaturity will further materialize the delay for this tech to reach Android smartphones and tablets.

The report also mentions that Chinese Xiaomi is the only company that is now a potential customer for the upcoming technology, and it is awaiting the market's response to Apple's 3D sensing tech in the iPhone 8 before it develops its own 3D sensing devices. Key component suppliers have already allocated resources to Apple leaving Qualcomm to find different supplies for sufficient resources. According to the analyst, this is where the disparity lies between the two companies and this is what will eventually be displayed once Apple announces the iPhone 8.

Other reports by Click Lancashire

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